View CB1EBH-10S-15H-PEJC2_352280.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

NEW
Memory Stick(R) Connectors
CB1 Series
Card Push Insert/Push Eject
q Card ejection distance of 10 mm q Mounting height of 3.5 mm q Mounting area: Smaller design is 78% of former size
sOutline
Receptacle connectors for use with the new generation of digital media devices requiring "Memory Stick(R) " type of consumer removable memory card. Several variations are available: Miniature, Low Profile and with or without ejection mechanism.
Button Touch Ejection
sFeatures
1. Indication of Incorrect Card Insertion
The connector will not allow the card to be complete inserted from the wrong end or reversed. The card will stop about 7mm before complete insertion position, visually indicating incorrect insertion.
2. Protection of the Contacts
Incorrect insertion of the card will not damage the contacts. The card can be easily withdrawn and reinserted correctly.
q Card ejection with tactile button operation q Card ejection distance of 10 mm q Equipped with card ejection switch
3. Excellent Card Handling
The type that is equipped with an ejection mechanism provides a long ejection of the card which offers excellent card handling qualities.
*Memory Stick is a registered trademark of the Sony Corporation.
Without Card Ejection
q Miniaturized, low profile design q Improved installation to the equipment is permitted using (M1.7) tapping screws q Can be equipped with an ejection mechanism depending on the design of the equipment side portion Note: Please position the card ejection button at the side of the equipment.
2003.12
1
sProduct Specifications
Current rating 0.5A Rating Voltage rating 125V AC Operating temperature range -20c to +85c(Note) -40c to +85c Operating humidity range Relative humidity 96% max. (No condensation)
Storage temperature range
Item 1. Insulation resistance 2. Withstanding voltage 3. Contact resistance 4. Vibration 5. Humidity
Specification 1000 M ohms min. No flashover or insulation breakdown 100 m ohms max. No electrical discontinuity of 1 s or more Contact resistance: 40 m ohms max. from initial value Insulation resistance: 100 M ohms min. Contact resistance: 40 m ohms max. from initial value Insulation resistance: 100 M ohms min. Contact resistance: 40m ohms max. from initial value No deformation of any component. No affect on contacts 500 V DC
Conditions 500 V AC / one minute 100mA DC Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours / 3 axis 96 hours at temperature of 40c2c and humidity of 90% to 95% Temperature: -55c/+5c to +35c/+85c/+5c to +35c Duration: 30/5/30/5(Minutes) 5 cycles 12000 cycles at 400 to 600 cycles per hour Reflow: At the recommended temperature profile Manual soldering: 300c for 3 seconds
6. Temperature cycle 7. Durability (mating/unmating) 8. Resistance to soldering heat
Note :Includes temperature rise caused by current flow.
sMaterials
Part
Insulator Contacts
Material
Heat resistant glass reinforced therm oplastic compound Phosphor bronze
Finish
Color: Black Contact area: Gold plated Termination area: Tin-Iead plated or tinned copper plated Contact area: Nickel plating Termination area: Tin-Iead plated or tinned copper plated -------------------
Remarks
UL94V-0 ----------
Metal hold down Cover Eject mechanism components
Phosphor bronze or stainless steel Stainless steel or cupper alloy Stainless steel Heat resistant glass reinforced therm oplastic compound
CB1E,CB1F,CB1G Series is without the termination area.
The CB1E Series has termination area with tin-lead plated. UL94V-0
sOrdering information
CB 1 E - 10 S - 1.5 H - PEJC - *
1 2 3
: CB :1
4
5
6
7
8
9
1 Series name 2 Series No. 3 Ejector type
:C E With eject mechanism F G D Without eject mechanism A 4 Number of contacts : 10 5 Connector type S : Receptacle
}
}
6 Contact pitch : 1.5 mm 7 Surface mount 8 Eject mechanism codes:
PEJC : Card Push insert/Push eject EJL : Left button eject EJR : Right button eject
9 Suffix
2
sLow Profile, Push Insert-Push Eject
Card pushed for ejection Card ejected Card fully inserted 29.4 26.8 (5.525) Memory stick card outline
BPCB mounting pattern
3.85 (3.25)
(31)
1.90.1 (19.8) (21)
26.80.1
1.90.1
26.60.1
33
Part No. CB1G-10S-1.5H-PEJC2
CL No. CL689-0037-5
26.2
1.90.1
3.2
40.1
0.90.05 P=1.50.03 3.5
9.30.05
0.6 P=1.5 13.5
CONTACT No.1 9.3
sButton Touch Eject
Card ejected 27.75 22.75 Card fully inserted 11.975 (5.525)
BPCB mounting pattern
Memory stick card outline 3.85 (3.25) Eject stroke (2)
(23)
32.500.3
.2
1 0. 0 + 0. -
4O3
(13)
(0.8)
18.3 34.9
10.9
Part No. CB1F-10S-1.5H-TEJL-PA
CL No. CL689-0028-4
16.50.03 1.50.03
4.5
11.150.03
3.40.1
.8
1 0. +0
0.60.05 0.90.05 0.6 P=1.5 13.5 32.5 37 O0.55 0.4 3 4.2 CONTACT No.1 3.5 P=1.50.05 13.50.05
30.05 4.20.05
11.15
O1.2 16.5
1.5
sWithout Card Ejection
24.7
BPCB mounting pattern
3.5
5.30.1 2.650.03
2-O
1.3
.05 +0 0
19.5
O1
0 .05
.3
O1
.3 +0
6.10.05
.3 O1
1.4 5.5
1.050.05 4.150.05
+0 0 .0
18.70.03
5
O1
10.900.3
39.8
18.300.3
5
1.45
CONTACT No.1 0.6 P=1.5 13.5 24.5
4.15 5.8 6.95
3.55
0.3
20.1
10.1 P=1.50.05 13.50.05 5.80.05
10.1
Part No. CB1D-10S-1.5H
CL No. CL689-0021-5
0.6
O1.2 18.7
4.15
20.1
6.10.05
.4 O2 4-
3
sPush Insert-Push Eject
Card ejected (19.5) (13.3) Card fully inserted Card pushed for ejection (12)
q Normal type
30.4 26.8 (5.525) Memory stick card outline (3.25)
BPCB mounting pattern
2.40.1 26.80.1 2.40.1
240.03 3.2
Part No. CB1EB-10S-1.5H-PEJC2
CL No. CL689-0026-9
10.1
10.50.1
8.60.1
40.8 24
40.1
40.1
0.90.05 P=1.50.03 9.30.05
CONTACT No.1 0.6 P=1.5 13.5 9.3
(3.5)
(19.5) Card ejected Card fully inserted (13.3) Card pushed for ejection (12)
q With "U" cut-out
30.4 26.8 13.4 (5.525)
BPCB mounting pattern
8.85 3.85 Memory stick (3.25) card outline 2.40.1 26.80.1 2.40.1
24
15.1 3.2
240.03 10.50.1 8.60.1 40.1
Part No. CB1EBG-10S-1.5H-PEJC2
CL No. CL689-0034-7
10.1
40.8
40.1
0.90.05 P=1.50.03
9.30.05
0.6 P=1.5 13.5
CONTACT No.1 3.5 9.3
Card pushed for ejection
q With square window
(19.5) Card ejected (13.3) Card fully inserted
8.1
29.4 26.8 8.3 (5.525) Memory stick card outline 3.85 (3.25)
BPCB mounting pattern
1.90.1 26.80.1 1.90.1
3.6
23.8
3.2
240.03 10.50.1 8.60.1 40.1 24
Part No. CB1EBH-10S-1.5H-PEJC2
CL No. CL689-0035-0
10.1
40.8
40.1
(12)
0.90.05 P=1.50.03
9.30.05
0.6 P=1.5 13.5
CONTACT No.1 3.5 9.3
4
sLeft Ejection
Card ejected 23.1 21.8 4.45 3.65 Eject stroke (6) 0.1 4.05 Memory stick card outline 8.75 16.45
3.5 5.2
(3.3)
O1
53.45
.8
CB1C-10S-1.5H-EJL(56)
CL689-0006-1-56
47.95 26.45
Part No.
CL No.
BPCB mounting pattern
Front edge of the printed circuit board 48MAX 10.50.03 30.1
1 2-O .3
.05 +00
51.45
10.5 3.45
4.650.05
6.55
5.55
29.9 4.950.05 CONTACT No.1
2 4.55
0.6 P=1.5 13.5
.2 O1 2-
0.40.05
2.40.1
0.90.1 P= 1.50.05 13.50.05
3.20.1 4.550.05
sRight Ejection
Card ejected 23 21.8
9.25 4.05
17.35
Memory stick card outline
5.5
4.4 3.65
3.2
O2 .
3
Part No. CB1C-10S-1.5H-EJR(59)
CL No. CL689-0007-4-59
23.4 10.5
5.55
Front edge of the printed circuit board 4.650.05
5 .0 +0 0
3.45
BPCB mounting pattern
41MAX 10.50.03 30.1
2 4.55
0.6 P=1.5 13.5
43.95
47.15
53.45
Eject stroke (3.3)
8.6
(6)
2. O1 2
31.2 CONTACT No.1
O 2-
1.
3
0.40.05
0.90.1 P=1.50.05 13.50.05
3.20.1 4.550.05
4.950.05
2.40.1
5.5
5
sWith flange, for screw attachment
33.45 16.5 13.5 P=1.5 1.5
BPCB mounting pattern
4.725 1.7 0.6 0.5 CONTACT No.1 30.05 26.3
8 2O1 .
30.050.05 4.7250.05 5.25
.2 O2
16.50.05
ol O2 .2
+ 0 0 .2
P=1.50.05
1.9
4.4
7.40.1
(h
20.3 18.6
1.2
Part No. CB1A-10S-1.5H(57)
CL No. CL689-0001-8-57
2 19.25
4.90.1 4.40.05 11.60.1
0.90.05 2.750.1
5.3 3.30.1 3.80.1
1.5
O2
sWithout flange
16.5 13.5 P=1.5
BPCB mounting pattern
16.50.05 13.50.05 26.3 0.5 0.6 CONTACT No.1 5.25 7.40.1 P=1.50.05
3.80.1 4.10.1 3.80.1 4.10.1
e) ol (h
4.90.1
18.6
11.60.1
20.3
0.90.05
.1 O2 2-
1.2
2.750.1
Part No. CB1AA-10S-1.5H(57)
CL No. CL689-0002-0-57
26.7 19.25 2
3.30.1
5.3
3.80.1
1.5
O2
BMemory Stick card insertion direction BMemory Stick fully inserted dimensions
21.45 1.35 2.8 4.4
6
9.5
40.5
6.30.1 6.60.1
1 0. +0
6.30.1 6.60.1
.1 O2 2.1 +0 0
2.9
e)
13.50.05
2 0. +0
e) ol (h
e) ol (h
sPackaging specification (Tray packaging)
q Part Number: CB1G-10S-1.5H-PEJC2(1 tray: 40 pieces) q Part Number: CB1F-10S-1.5H-TEJL-PA(1 tray: 20 pieces)
0 330 -1
0 330 -1
30.10.2
30.10.2
430.2
3200.5 2520.3 P=360.2 A
PS 40PICS
1000.2
3200.5 1950.3 P=650.2 A A
A
PS
2150.5 1600.3 P=400.2
CB1G SERIES
2150.5 1600.3 P=400.2
225 -1
0
225 -1
0
2 0 PI CS
q Part Number: CB1D-10S-1.5H(1 tray: 50 pieces)
q Part Number: CB1EB*-10S-1.5H-PEJC2(1 tray: 25 pieces)
0 330 -1
0 330 -1
27.50.2
3200.5 32.250.2 190.2 255.50.3 P=36.50.2 B
3200.5 2200.3 550.2 P=550.2 A
CB1F(TEJL1)
A
B
PS
2150.5 1770.3 P=29.50.2
2150.5 1600.3 P=400.2
0 225 -1
225 -1
0
25PICS
q Part Number: CB1C-10S-1.5H-EJL(56)(1 tray: 20 pieces)
q Part Number: CB1C-10S-1.5H-EJR(59)(1 tray: 20 pieces)
33.40.2 29.50.2
A A
27.50.2
0 330 -1 3200.5 253.20.3 P=63.30.2
0 330 -1 3200.5 2220.3 550.2 P=740.2
CB1E(PEJC1)
B
B
0 225 -1 2150.5 1560.3 P=520.2
0 225 -1 2150.5 1600.3 P=400.2
20PICS
CB1C(L1)
20PICS
q Part Number: CB1A*-10S-1.5H(57)(1 tray: 50 pieces)
21.750.2 190.2
0 330 -1 3200.5 276.50.3 P=39.50.2
C
C
0 225 -1 2150.5 1770.3 P=29.50.2
CB1C(R1)
CB1A(1)
7
BUsage Precautions
1.Care should be taken to correctly insert/withdraw the Memory Stick(R) card. Following correct insertion/withdrawal procedures will prevent device or connector damage. When handling the CB1C series connectors, hold it in the areas indicated by the arrows, as illustrated below.
CB1A Series
CB1C Series
Contacts Recommended holding area Recommended holding area Contacts, metal hold-down and ejection components areas Metal hold-down
2.Follow the recommended insertion angles, as illustrated below.
CB1A Series
Outline of the Memory Stick card
CB1C Series
2MA X
1MAX
1M
AX
Outline of the Memory Stick card
00
.22
0.5
MAX
0.
2M
AX
15
Initial insertion (15 mm max.)
Complete insertion (from 15 mm to full insertion)
8
3.When inserting or withdrawing cards from the CB1C Series, the side contacts on both sides will protrude outward by 0.6 mm. Care should be taken that they will not be restricted or touch other components.
side contact
(0.6)
4. Application of an excessive external force to the push rod may prevent the ejection or insertion of the card. Do not apply any load in a direction other than the push direction.
Push direction
Do not twist or bend !
Do not pull !
Push rod
9
sRecommended Temperature Profile
300c
IR Reflow Conditions Preheating : 150c 30 to 90 sec. Soldering : 2355c 10 sec. max. 220c min. 10 to 20 sec.
200c Soldering 150c Preheating 100c 240c max. 220c
0c
0S
50S
100S
150S
200S

Reflow system : IR reflow Solder : Paste type 63 Sn/37 Pb (Flux content 9 wt%) Test board : Glass epoxy 60mm x 100mm x 1.6 mm Metal mask thickness : 0.15 mm Recommended temperature. The temperature may be slightly changed according to the solder paste type and volume used.
10

▲Up To Search▲

Price & Availability of CB1EBH-10S-15H-PEJC2

	To Download CB1EBH-10S-15H-PEJC2 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .